Amkor Technology Inc. logo

Amkor Technology Inc.

AMKR | NASDAQ
Chart Builder DCF Calculator
$52.19
+$1.89 (+3.76%)
At close: Sep 21, 2026, 4:00 PM ET
$52.39
+$0.20 (+0.38%)
After-hours: Sep 21, 2026, 7:59 PM ET

Company Profile

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Key Executives

Name Position
Kevin Engel President, Chief Executive Officer & Director
Megan Faust Executive Vice President, Chief Financial Officer & Treasurer
Cherie Buntyn Senior VP & Chief Accounting Officer
Farshad Haghighi Executive Vice President & Chief Sales Officer
Jennifer Jue Vice President of Investor Relations & Finance
JinAn Lee Executive Vice President of Worldwide Manufacturing
John Don Liu Executive Vice President, Corporate Development & Strategy
Mark N. Rogers Executive Vice President, General Counsel & Corporate Secretary
Susan Y. Kim Chairman

Latest SEC Filings

Date Type Title
Aug 19, 2026 4 Filing
Aug 13, 2026 4 Filing
Aug 11, 2026 4 Filing
Aug 07, 2026 4 Filing
Jul 31, 2026 4 Filing
Jul 31, 2026 4 Filing
Jul 28, 2026 10-Q Quarterly Report
Jul 27, 2026 8-K Current Report
Jul 22, 2026 4 Filing
Jul 22, 2026 4 Filing
View All SEC Filings
Amkor Technology Inc.
Amkor Technology Inc. logo
Country United States
IPO Date Apr 30, 1998
Industry Semiconductors
Sector Technology
Employees 30,800
CEO Kevin K. Engel

Contact Details

2045 East Innovation Circle Tempe, Arizona 85284 United States

Stock Details

Ticker Symbol AMKR
Exchange NASDAQ
Fiscal Year January - December
Reporting Currency USD
CIK Code 0001047127
CUSIP Number 031652100
ISIN Number US0316521006
SIC Code 3674

© 2026 bestshares.com. All rights reserved.